Ou KL |
------>authors3_c= ------>paper_class1=1 ------>Impact_Factor=1.514 ------>paper_class3=2 ------>paper_class2=1 ------>vol=83 ------>confirm_bywho=wpdeng ------>insert_bywho=klou ------>Jurnal_Rank=18.2 ------>authors4_c= ------>comm_author= ------>patent_EDate=None ------>authors5_c= ------>publish_day=1 ------>paper_class2Letter=None ------>page2=318 ------>medlineContent= ------>unit=F0700 ------>insert_date=20051209 ------>iam=1 ------>update_date=None ------>author=??? ------>change_event=6 ------>ISSN= ------>authors_c= ------>score=-10000 ------>journal_name=MICROELECTRONIC ENGINEERING ------>paper_name=Integrity of Copper-Hafnium, Hafnium Nitride and Multilayered Amorphous-like Hafnium Nitride Metallization under Various Thickness ------>confirm_date=20071213 ------>tch_id=092057 ------>pmid=no found ------>page1=312 ------>fullAbstract=no found ------>tmu_sno=None ------>sno=12104 ------>authors2= ------>authors3= ------>authors4= ------>authors5= ------>authors6= ------>authors6_c= ------>authors=Ou KL ------>delete_flag=0 ------>SCI_JNo=None ------>authors2_c= ------>publish_area=0 ------>updateTitle=no found ------>language=2 ------>check_flag=None ------>submit_date=None ------>country=None ------>no=2 ------>patent_SDate=None ------>update_bywho=None ------>publish_year=2006 ------>submit_flag=None ------>publish_month=1 |