Shen YK |
------>authors3_c= ------>paper_class1=1 ------>Impact_Factor=0.945 ------>paper_class3=2 ------>paper_class2=1 ------>vol=31 ------>confirm_bywho=None ------>insert_bywho=ykshen ------>Jurnal_Rank=42.9 ------>authors4_c= ------>comm_author= ------>patent_EDate=None ------>authors5_c= ------>publish_day=1 ------>paper_class2Letter=None ------>page2=702 ------>medlineContent= ------>unit=F0600 ------>insert_date=20081202 ------>iam=1 ------>update_date=None ------>author=??? ------>change_event=1 ------>ISSN= ------>authors_c= ------>score=-10000 ------>journal_name=International Communications in Heat and Mass Transfer ------>paper_name=Study on Warpage and Shrinkage of Flip Chip Encapsulation Process ------>confirm_date=None ------>tch_id=096026 ------>pmid=no found ------>page1=693 ------>fullAbstract=no found ------>tmu_sno=None ------>sno=20368 ------>authors2=Liao JH ------>authors3=Zhao WX ------>authors4= ------>authors5= ------>authors6= ------>authors6_c= ------>authors=Shen YK ------>delete_flag=0 ------>SCI_JNo=None ------>authors2_c= ------>publish_area=0 ------>updateTitle=no found ------>language=2 ------>check_flag=None ------>submit_date=None ------>country=None ------>no=5 ------>patent_SDate=None ------>update_bywho=None ------>publish_year=2004 ------>submit_flag=None ------>publish_month=1 |