Taipei Medical University

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Shen YK
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------>journal_name=International Communications in Heat and Mass Transfer
------>paper_name=Resin Flow Characteristic of Underfill Process on Flip Chip Encapsulation
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------>authors2=Ju CM
------>authors3=Shie YJ
------>authors4=Chein HW
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------>authors=Shen YK
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------>publish_year=2004
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A B C D E F G H I J K L M N O P Q R S T U V W X Y Z