B.Y. Pemg |
------>authors3_c= ------>paper_class1=1 ------>Impact_Factor=1.504 ------>paper_class3=2 ------>paper_class2=1 ------>vol= ------>confirm_bywho=None ------>insert_bywho=ykshen ------>Jurnal_Rank=37.8 ------>authors4_c= ------>comm_author=1 ------>patent_EDate=None ------>authors5_c= ------>publish_day=1 ------>paper_class2Letter=None ------>page2= ------>medlineContent= ------>unit=F0600 ------>insert_date=20090312 ------>iam=3 ------>update_date=None ------>author=??? ------>change_event=2 ------>ISSN= ------>authors_c= ------>score=-10000 ------>journal_name=Polymers for Advanced Technologies ------>paper_name=Microfluidic chip fabrication using hot embossing and thermal bonding of COP (Accepted) ------>confirm_date=None ------>tch_id=096026 ------>pmid=no found ------>page1= ------>fullAbstract=no found ------>tmu_sno=None ------>sno=21377 ------>authors2=C.W. Wu ------>authors3=Y.K Shen ------>authors4=Y. Lin ------>authors5= ------>authors6= ------>authors6_c= ------>authors=B.Y. Pemg ------>delete_flag=0 ------>SCI_JNo=None ------>authors2_c= ------>publish_area=0 ------>updateTitle=no found ------>language=1 ------>check_flag=None ------>submit_date=None ------>country=None ------>no= ------>patent_SDate=None ------>update_bywho=None ------>publish_year=2009 ------>submit_flag=None ------>publish_month=1 |